America’s Homeland Security Technology Accelerator she chose a Microsoft And Qualcomm NS Development of custom chips for the United States Army, as confirmed by the agency itself, as part of a plan to ensure that the US Department of Defense has access to the latest domestic technologies in the manufacture and development of chips.
The project they will develop, known as Secured Rapid Prototyping for Microelectronics (RAMP), designed forDeliver best business practices to help accelerate development and achieve the design and manufacture of reliable, secure, and state-of-the-art microelectronics for defense and homeland security applications«.
According to Microsoft, in the company, they hope to leverage the RAMP project to take advantage of a scalable microelectronics supply chain, while ensuring that design and manufacturing meet safety and regulatory compliance requirements.
As part of its role in the second phase of the RAMP project, for which it was selected with Qualcomm, Microsoft has engaged several of its microelectronics partners from the business and defense sectors in the process. Among them are BAE Systems, Cadence Design Systems, GlobalFoundries, Siemens EDA, Raytheon Intelligence and Space.
At the moment, details of the chips the companies on the plan gave their design to at this point in the project are still unknown, although Microsoft says the goal it’s trying to achieve with the new designs is to help reduce power consumption, improve performance, and reduce their physical size. and improve its reliability, with the aim of enhancing its use in the systems of the Ministry of Defense.
For those from Redmond, who will be hosting the solution they are designing in Azure government, its own cloud area for enterprise customers, «The RAMP solution will provide an advanced microelectronics development platform for mission-critical applications, enabling cloud, artificial intelligence, and automation through machine learning, security, and measurable reliability.«.
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